<p>CSEI at cseinc.org performs thermal convection heat transfer analysis, thermal analysis, heat transfer analysis, thermal stress analysis, convection heat transfer, conduction heat transfer, radiation heat transfer and cast solidification analysis.</p> <p>CSEI at cseinc.org performs thermal conduction heat transfer analysis by finite element analysis (FEA), thermal analysis by finite element analysis (FEA), heat transfer analysis by finite element analysis (FEA), thermal-stress analysis by finite element analysis (FEA), heat transfer analysis by finite element analysis (FEA), convection heat transfer analysis by finite element analysis (FEA), conduction heat transfer analysis by finite element analysis (FEA) and cast solidification analysis by finite element analysis (FEA).</p> <p>CSEI at cseinc.org performs thermal radiation heat transfer analysis by FEA, thermal analysis by FEA, heat transfer analysis by FEA, thermal stress analysis by FEA, heat transfer analysis by FEA, convection heat transfer analysis by FEA, conduction heat transfer analysis by FEA, and cast solidification analysis by FEA.</p>

Thermal And Heat Transfer Analysis


A thermal analysis may be used to determine the temperature distribution within a structure or manufactured product based upon temperatures, heat fluxes, convections, and radiation applied to the structure or manufactured product in either steady-state or transient time-frame. A thermal-stress analysis should be used to take the steady-state or transient temperature distributions within a structure or manufactured product along with other applied structural loading and determine the steady-state or transient response of the structure or manufactured product.

Analysis Capabilities

Heat conduction analysis
Heat flux and convection analysis
Nonlinear radiation analysis
Heat sources and heat sink analysis
Steady-state linear and nonlinear thermal analysis
Transient linear and nonlinear thermal analysis
Phase change (melting or solidification) analysis
Thermal-stress analysis

Applications

Printed circuit board and computer chassis thermal analysis.
Braking systems thermal analysis.
Casting solidification.
Thermal and residual stress effects of heat treating products.
Expansion and contraction of products subjected to varying temperatures.
Heat generated due to component friction.
Deformation and stress generated in structures and manufactured products acted upon by partial or global temperature changes.


CSEI - Application of finite element analysis in the design process