CSEI at cseinc.org provides stress analysis utilizing finite element analysis (FEA) for mechanical electromagnetic design and mechanical electromagnetic failure analysis.
CSEI at cseinc.org provides stress analysis utilizing finite element analysis (FEA) for product electromagnetic design and product electromagnetic failure analysis.
CSEI at cseinc.org utilizes mechanical stress analysis by applying finite element analysis (FEA) to identify electromagnetic effects in manufactured products subjected to failure analysis.
Various forms of electromagnetic analyses may be carried-out to determine magnetic and electric properties resulting from magnetic fields and electric fields, or coupled with other forms of analysis to determine temperature, deformation, and stresses resulting from those magnetic and electric fields.
Steady-state and transient electromagnetic analysis | |
Electrostatic analysis | |
Electric circuit analysis | |
Voltage, charge and charge density analysis | |
Joule heating analysis | |
Steady-state, harmonic, and transient magnetic analysis |
Magnetic-Thermal Analysis | |
Magnetic-Structural Analysis | |
Piezoelectric, Electric Field-Structural Analysis | |
Electric Field-Thermal Analysis | |
Electromagnetic Analysis | |
Thermal-Structural Analysis |
ABS ring electromagnetic analysis. | |
Electromagnetic conductor analysis. | |
Current transformer analysis. | |
Circuit board electromagnetic analysis. | |
Transmission line analysis. |